Thermal Management Concepts in Microelectronic Packaging.
Silver Spring, MD: The International Society for Hybrid Microelectronics, 1984. 362 pp. 8vo. Paperback. Shelfwear and soiling, lt crease to front joint, bump w/ small closed tear to spine just above foot. Spine lightly tanned. Full title: "Thermal Management Concepts in Microelectronic Packaging, From Component to System". Very Good Paperback 0930815017 (Item ID: 132010)